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The channel contention access principle of Wi-Fi. The core of Wi-Fi equipment access lies in carrier sense multiple access / collision avoidance (CSMA/CA). This mechanism of listening before speaking has been in use since the first generation of Wi-Fi (802.11) in 1997. However, there were few wireless network devices more than 20 years ago, and no one would consider the network congestion caused by competition when the number of devices increased. The real popularity of Wi-Fi began with Wi-Fi 4 (802.11n) in 2008. It can be said that since then, Wi-Fi has really become the most common form of Internet access for homes and businesses. The number of device models that support Wi-Fi has also increased exponentially.

Then, as demand for cars picks up in the fall of 2020, Toyota Denso Renesa plans to order 28nm semiconductors from TSMC again, but there is no room to produce in-car semiconductors because TSMC lines are occupied by other semiconductors. Although the inventory in the autumn and winter of 2020 exceeded the limit, by 2021, inventory had bottomed out, coupled with the shortage of 28nm semiconductors, cars could not be made. 28nm is the last generation of planar transistors (FinFET from 16 / 14nm to 3D) (2) do not use self-aligned double pattern (SADP) (will use SADP from FinFET) (3) Renesas vertical integration (integrated equipment manufacturer IDM), for example, outsource production to FinFET from this generation. In short, 28nm semiconductors produced by TSMC and other contract factories have a good performance-to-price ratio, so many electronic devices, including automobiles, use this semiconductor. At the invitation of the Japanese government, the TSMC Kumamoto plant, which will begin operation in 2024, will also mainly produce such 28nm semiconductors.

In the onboard system shown in the figure above, the green rectangle represents the printed circuit board (PCB), and the small rectangles of various colors above represent various functional modules in the system, such as memory. The functions of these modules are implemented by independent silicon chips, and they are connected by metal traces on the PCB to finally form a complete system. The System-on-Chip refers to the realization of the functions of the entire system on a single silicon chip. The schematic diagram is as follows: As shown in the figure above, a system-on-a-chip (SoC) implements various functional modules such as storage, processing, logic, and interfaces in one chip, rather than requiring several different physical chips to be implemented like a system-on-board. Compared with system-on-board, SoC solutions are lower cost, enable faster and more secure data transfer between different system units, have higher overall system speed, lower power consumption, smaller physical size, and better reliability.

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